It can be used for high power modules (such as IGBT) packaging. It has high thermal conductivity, high electrical conductivity and high reliability. Excellent rheological properties make it suitable for the printing process. It supports no pressure or pressure rapid sintering process. The maximum bonding wafer size is 12mm*12mm.

HS-402 semi-sintered nano-silver adhesive is used for high-power modules (such as IGBT) packaging. It has high thermal conductivity, high electrical conductivity and high reliability. In addition, it’s suitable for dispensing process.  The sintering temperature of this paste is relatively low (200℃).