Molybdenum-manganese paste is a screen-printed conductor paste utilized in the fabrication of metal electrodes for the surface metallization of alumina substrates or in the high-temperature co-fired ceramic (HTCC) process. This paste offers several benefits, including excellent printing stability, favorable wettability at the ceramic interface following high-temperature sintering, strong bonding, superior densification, and effective compatibility of expansion coefficients.
(1)HS-M01 is a screen-printed thick film conductor paste for the fabrication of metal electrodes, designed for surface metallization of alumina substrates or in high-temperature co-fired ceramic processes.
(2)HS-M02 is a screen-printed thick film conductor paste for the fabrication of metal electrodes, designed for surface metallization of alumina nitride substrates or in high-temperature co-fired ceramic processes.
(3)HS-M03 is a screen-printed thick film conductor paste for the fabrication of metal electrodes, designed for surface metallization of silicon nitride substrates or in high-temperature co-fired ceramic processes.